产品介绍

导电银浆

Different Thinking to Move Forward, Functional Pastes

作为一种高科技环保材料,主要用于面向未来的 IT 设备、工业设备和汽车电装等精密和创新行业。凭借昌星功能性浆料的可靠性和高效性,我们实现了第n次工业革命的高科技材料梦想。

功能性浆料一般是由功能性填充物、粘合剂和溶剂均匀分散并具有流动性的复合材料。功能性填充物根据浆料的用途金属、陶瓷、碳等、粘合剂根据基板种类和热处理温度使用玻璃料(glass frits)、高分子树脂(Polymer resin)等。根据印刷(Printing)、浸渍(Dipping)、点胶(Dispensing)等应用工艺调整流变性能,从而赋予功能性浆料的可加工性。

应用领域
∙ IT设备、汽车电装和家用电器的零件

- 贴片元件
: 贴片电感/MLCC/贴片压敏电阻
- 柔性电路
: 薄膜/RFID标签/触摸屏
- PCB 应用
: PCB 通孔/柔性 PCB
- 电子陶瓷
: 压电元件/微波
- 电子控制装置
: 功率模块、热电模块
- 绝缘包覆

低温固化型

昌星的低温固化型浆料使用最优秀的Ag Flake粉末, 具有良好的印刷特性及导电性

薄膜触摸开关用浆料

멤브레인 터치 스위치용 페이스트
Product No. Filler Curing Conditions Resistance (mΩ/□/mil) Viscosity (Pa·s @ 50rpm) Comments
Paron-910 Series Ag 130°C/30~60min 15-50 15-25 ㆍLow resistivity
Paron-962 Series 150°C/30~60min 10-20 15-25 ㆍHalogen free, Low resistivity
Paron-960 Series 140°C/30~60min 15-20 10-20 ㆍHalogen free, Excellent flexibility
Paron-950 Series 80°C/30~60min 15-30 15-30 ㆍLow temperature curing
Paron-951 Series 90°C/30~60min 20-40 5-20 ㆍHalogen free, Low temperature curing
Paron-930 Ag+C 130°C/30~60min 40 12-16 ㆍCarbon blended, Low cost
Paron-920 C 15,000 15-25 ㆍFlexible carbon paste
Paron-921 15,000 20-30 ㆍHalogen free, Flexible carbon paste

PCB/FPCB用浆料

PCB / FPCB용 페이스트
Product No. Filler Curing Conditions Resistance (μΩ/□/mil) Viscosity (Pa·s @ 50rpm) Comments
Paron-611 Series Ag 150°C/30-60min 25-50 20-30 ㆍHigh reliability, Low resistivity
Paron-621 Ag
(Ag/Cu)
50°C, 70°C, 150°C
/each 30min
200 6 ㆍHigh reliability, Low resistivity
Paron-650N 6 ㆍLow cost

触摸屏电极用浆料

터치스크린 전극용 페이스트
Product No. Filler Curing Conditions Resistance (μΩ/□/mil) Viscosity (Pa·s @ 50rpm) Fine line width(㎛) Comments
Paron-810 Series Ag/Ni 130°C/30min 30-60 20-30 100-200 ㆍResistive type
Paron-811 Series Ag/Cu 30-50 50-70 40-80 ㆍCapacitive type
Paron-813 Series Ag 30-60 50-70 (Pa˙s @ 10rpm) - ㆍLaser etching type

绝缘用浆料

절연용 페이스트
Product No. Filler Curing Conditions Resistance (μΩ/□/mil) Viscosity (Pa·s @ 10rpm) Comments
Paron-310 Resin 300 ~ 600 mJ/cm² 1010 15 ㆍGreen color
Paron-310T 500 ~ 1,000 mJ/cm² 1010 40 ㆍColorless & Transparency

高温烧结型

昌星的高温烧结型浆料是一种在较宽的温度范围内针对各种基材进行优化烧结性和电阻特性的产品。

芯片元件(内部电极)用浆料

칩부품(내부전극) 페이스트
Product No. Filler Firing Conditions Viscosity (Pa·s @ 10rpm) Comments
Paron-L69 Ag 850-900℃ 200-300 ㆍAg 82%, 88%, 90%
ㆍExcellent line resolution
Paron-L80 Ag 850-900℃ 200-300 ㆍAg 78%, 82%, 85%, 88%, 90%
ㆍHigh sintering density
Paron-L10 Ag 850-900℃ 200-300 ㆍAg 82%-88%
ㆍSlow sintering
ㆍLow shrinkage
Paron-L62 Ag 850-900℃ 200-300 ㆍAg 88%
ㆍFine line
Paron-L90 Ag 850-900℃ 250-350 ㆍL90A : Fine line (30um)
ㆍL90B : High aspect ratio (rectangular form)
Paron-L20 Ag 600-850℃ 200-300 ㆍL20A : High shrinkage
Paron-V10 Pd 1,100-1,300℃ 50 ㆍHigh reliability
Paron-V22 Ag/Pd=8/2 850-1,050℃ 35 ㆍElectrical property control, Low cost
Paron-V23 Ag/Pd=7/3 950-1,100℃ 30 ㆍElectrical property control
Paron-P30 Ag98/Pd2 920-940℃ 30-50 ㆍMLPZT : Excellent sheet matching
Paron-P31 Ag 910-930℃ 30-50 ㆍMLPZT : Excellent heat resistamce

芯片元件(外部电极)用浆料

칩부품(외부전극) 페이스트
Product No. Filler Firing Conditions Viscosity (Pa·s @ 10rpm) Comments
Paron-L65A Ag 650-800℃ 30-40 ㆍAg 65%
ㆍThin thickness, Low Ag
Paron-L65B Ag 620-650℃ 30-40 ㆍAg 75%
ㆍUniform shape, dense sintered structure
Paron-L65C Ag 650-670℃ 65-75 ㆍAg 80%
ㆍLow resistance, high reliability
Paron-E10 Ag 150-200℃/30-60min 20-60 ㆍUniform thickness
ㆍExcellent conductivity
Paron-E30 Cu 150-200℃/30-60min(N2) 20-40 ㆍLow cost, good adhesion
Paron-C77 Cu 800-900℃ 30-50 ㆍGood adhesion
ㆍMLCC

陶瓷(PTC/PZT/TPC)用浆料

세라믹(PTC/PZT/TPC)용 페이스트
Product No. Filler Firing Conditions Viscosity (Pa·s @ 10rpm) Comments
Paron-P11 Ag/Zn 580-630℃ 180-210 ㆍPTC : Ohmic Paste
Paron-P12 Ag 580-630℃ 180-210 ㆍPTC : Cover Paste
Paron-P10 Al 760-830℃ 36-44 ㆍAl electrode Paste
Paron-P96 Ag 750-850℃ 100 ㆍPZT (PbO free)
Paron-W38 Ag 800-890℃ 200 ㆍExcellent solderability, adhesion
Paron-W51 Ag 850-880℃ 200 ㆍAg paste for AlN substrate
Paron-W50 Ag 850-880℃ 200 ㆍAg paste for Al203 substrate
Paron-W41 Ag 700-750℃ 50 ㆍFor Low CTE Glass Substrate
Paron-W22 Ag < 300℃ 300 ㆍLow temperature pressure type, 230W/mK
Paron-D20 Cu 880-910℃(N2) 140-180 ㆍFor Ceramic Substrate

LTCC/HTCC用浆料

LTCC/HTCC용 페이스트
Product No. Filler Firing Conditions Viscosity (Pa·s @ 10rpm) Comments
Paron-L15N Ag 850-900℃ 200-220 ㆍInner paste for LTCC
Paron-L15G Ag 850-900℃ 240-280 ㆍGround paste for LTCC
Paron-L15V Ag 850-900℃ 220-260 ㆍVia paste for LTCC
Paron-L15T Ag 850-900℃ 4-6 ㆍThru paste for LTCC (Low viscosity)
Paron-MP2 Mo 1,300-1,500℃ 180-220 ㆍPattern paste
Paron-MV1 Mo 1,300-1,500℃ 260-300 ㆍVia fill paste
Paron-H10 W 1,300-1,500℃ 380-460 ㆍPattern paste
Paron-H12 W 1,300-1,500℃ 13-17 ㆍVia fill paste

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Required Characteristic
Remark

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(株)昌星

仁川广域市南洞区升基川路320
320 (南村洞620-8)

T. 032-450-8770 F. 032-450-8870 E. paste_cn@changsung.com

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