Electro Magnetic Compatibility

• Q&A Q&A

Chang Sung’s EMI Suppressors ensure the best performance because they are made of inhouse developed magnetic materials. These materials are essential to addressing electromagnetic noise issues and creating a more efficient communication environment.

- Effective suppression of the radiation noise
in a band range from 10MHz to 6GHz

- High electrical resistance(10⁶-10⁸Ω)

- Flexible and easy to handle

- Can be manufactured in various shapes, sizes and thicknesses (0.02mm to 1mm)

Applications

∙ Mobile, Network Equipment, Telecommunications, Automotive Electrical and Electronic Components, Consumer Electronics, Medical Equipment, Military application.

CSC’s Thermal Interface Materials are heat-radiating materials with high thermal conduction and provide effective solutions to internal heating issues observed in various electronic devices. These materials quickly transport heat from heat sources to heat sinks or the surroundings, preventing electronic components from overheating.

• TIM(Sheet Type)
• Gap Filler
• Liquid Molding Compound

TIM(Sheet Type)

- High thermal conductivity

- High conformability

- Low siloxane content or siloxane free

- Multi-Function

- High tensile strength

- Certification of UL94V-0

- Eco-Friendly

Applications

∙ Telecommunication Devices (Router)

∙ Power Industries (SMPS)

∙ Flat Panel Displays (OLED, LCD)

∙ Set-top Boxes (SD/HD)

∙ Graphic Cards and Processors

∙ Memory Modules (DDR, S-RAM)

∙ Microprocessors

∙ Inductor for Electric & Hybrid Vehicle / Inductor for Fuel Cell Module/nductor for Solar Cell Module

Gap Filler

Used between cells and heat sinks, glued to improve thermal properties.
superior to heat conductivity. Its all based on 2 Parts.

Applications

∙ High output LED heat Resistance plate

∙ Solar module inverter

∙ Electrical and hybrid automotive power modules
(power semiconductors)

∙ Heat Electric Device Heat Resistance Plate

∙ For various electronic equipment heat emission

Details Details

갭필러

Grade	Color	A/B Mixing Ratio (wt%)	Viscosity (Pa.s)	Density (g/cm3)	Thermal Conductivity (W/mK)	Volatility (%)	Flame Resistance (UL94)	Curing Condition (℃/hr)
TC-GF3501	A : Blue B : White	1:1	200	3.0	3.5	-	V-0	25/24 100/0.5
TC-GF4501	A : Blue B : White	1:1	220	3.2	4.5	-	V-0	25/24 100/0.5

Liquid Molding Compound

Liquid Molding Compound used for heat conduction and flame retardant purposes consisting of a two-liquid form

Applications

∙ Reactor for Electric & Hybrid Vehicle

∙ Reactor for Fuel Cell Module

∙ Reactor for Solar Cell Module

• Hybrid Automobile
• Electric Automobile

Details Details

방열몰딩액

Grade	A/B Mixing Ratio (wt%)	Viscosity (cps)	Density (g/cm3)	Hardness (Shore A)	Thermal Conductivity (W/mK)	Breakdown Voltage(kV)	Volume Resistivity (Ω·cm)	Curing Condition (℃/min)
TC-M10	100:100	20,000	1.70	40	1.0	> 5	> 1013	120/30
TC-M25	100:100	8,000	2.75	0	2.5	> 5	> 1013	100/40
TC-M35	100:100	20,000	2.90	5	3.5	> 5	> 1013	100/40