(株)昌星
仁川广域市南洞区升基川路320
320 (南村洞620-8)
功能性浆料一般是由功能性填充物、粘合剂和溶剂均匀分散并具有流动性的复合材料。功能性填充物根据浆料的用途金属、陶瓷、碳等, 粘合剂根据基板种类和热处理温度使用玻璃粉(glass frits)、高分子树脂(Polymer resin)等。根据印刷(Printing)、浸渍(Dipping)、点胶(Dispensing)等应用工艺调整流变性能, 从而赋予功能性浆料的可加工性。
应用领域昌星的低温固化型浆料使用最优化的Ag Flake粉末, 具有良好的印刷特性及导电性。
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-910 Series | Ag | 130°C/30~60min | 15-50 | 15-25 | ㆍLow resistivity |
| Paron-962 Series | 150°C/30~60min | 10-20 | 15-25 | ㆍHalogen free, Low resistivity | |
| Paron-960 Series | 140°C/30~60min | 15-20 | 10-20 | ㆍHalogen free, Excellent flexibility | |
| Paron-950 Series | 80°C/30~60min | 15-30 | 15-30 | ㆍLow temperature curing | |
| Paron-951 Series | 90°C/30~60min | 20-40 | 5-20 | ㆍHalogen free, Low temperature curing | |
| Paron-930 | Ag+C | 130°C/30~60min | 40 | 12-16 | ㆍCarbon blended, Low cost |
| Paron-920 | C | 15,000 | 15-25 | ㆍFlexible carbon paste | |
| Paron-921 | 15,000 | 20-30 | ㆍHalogen free, Flexible carbon paste |
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 50rpm) | Comments |
|---|---|---|---|---|---|
| Paron-611 Series | Ag | 150°C/30-60min | 25-50 | 20-30 | ㆍHigh reliability, Low resistivity |
| Paron-621 | Ag (Ag/Cu) |
50°C, 70°C, 150°C /each 30min |
200 | 6 | ㆍHigh reliability, Low resistivity |
| Paron-650N | 6 | ㆍLow cost |
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Fine line width(㎛) | Comments |
|---|---|---|---|---|---|---|
| Paron-810 Series | Ag | 130°C/20min | ≤ 20 | 150~200 | ≥ 80 | ㆍScreen printing type |
| Paron-811 Series | Ag | 130°C/20min | ≤ 20 | 50~100 | 15~20 | ㆍLaser etching type |
| Paron-813 Series | Ag/Cu | 130°C/10min | ≤ 35 | 150~200 | ≥ 100 | ㆍScreen printing type (Low cost) |
| Product No. | Filler | Curing Conditions | Resistance (mΩ/□/mil) | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|---|
| Paron-310 | Resin | 300 ~ 600 mJ/cm² | 1010 | 15 | ㆍGreen color |
| Paron-310T | 500 ~ 1,000 mJ/cm² | 1010 | 40 | ㆍColorless & Transparency |
昌星的高温烧结型浆料是一种在较宽的温度范围内针对各种基材具有优化的烧结性和电阻特性的产品。
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L69 | Ag | 850-900℃ | 200-300 | ㆍAg 82%, 88%, 90% ㆍExcellent line resolution |
| Paron-L80 | Ag | 850-900℃ | 200-300 | ㆍAg 78%, 82%, 85%, 88%, 90% ㆍHigh sintering density |
| Paron-L10 | Ag | 850-900℃ | 200-300 | ㆍAg 82%-88% ㆍSlow sintering ㆍLow shrinkage |
| Paron-L62 | Ag | 850-900℃ | 200-300 | ㆍAg 88% ㆍFine line |
| Paron-L90 | Ag | 850-900℃ | 250-350 | ㆍL90A : Fine line (30um) ㆍL90B : High aspect ratio (rectangular form) |
| Paron-L20 | Ag | 600-850℃ | 200-300 | ㆍL20A : High shrinkage |
| Paron-V10 | Pd | 1,100-1,300℃ | 50 | ㆍHigh reliability |
| Paron-V22 | Ag/Pd=8/2 | 850-1,050℃ | 35 | ㆍElectrical property control, Low cost |
| Paron-V23 | Ag/Pd=7/3 | 950-1,100℃ | 30 | ㆍElectrical property control |
| Paron-P30 | Ag98/Pd2 | 920-940℃ | 30-50 | ㆍMLPZT : Excellent sheet matching |
| Paron-P31 | Ag | 910-930℃ | 30-50 | ㆍMLPZT : Excellent heat resistamce |
| Product No. | Filler | Firing/ Curing conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L65A | Ag | 650-800℃ | 30-40 | ㆍAg 50% ㆍThin thickness, Low Ag |
| Paron-L65B | 650~700℃ | 30~40 | ㆍAg 65% ㆍUniform shape, dense sintered structure |
|
| Paron-L65E | 800~850℃ | 50~60 | ㆍAg 65% ㆍLow viscosity, high temp. |
|
| Paron-C77A1 | Cu | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 |
| Paron-C77A2 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77B0 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0402 | |
| Paron-C77B1 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-C77B2 | 750~800℃ | 25~35 | ㆍRecommend chip size(mm) : 1608, 2012, 3216 | |
| Paron-C77H1 | 800~850℃ | 25~35 | ㆍRecommend chip size(mm) : 0603, 1005 | |
| Paron-E10 | Ag | 150~200℃/30~60min. | 20~60 | ㆍSoft termination |
| Paron-E30 | Cu | 150~200℃/30~60min.(N2) | 20~40 | ㆍSoft termination (Low cost) |
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-P11 | Ag/Zn | 580-630℃ | 180-210 | ㆍPTC : Ohmic Paste |
| Paron-P12 | Ag | 580-630℃ | 180-210 | ㆍPTC : Cover Paste |
| Paron-P10 | Al | 760-830℃ | 36-44 | ㆍAl electrode Paste |
| Paron-P96 | Ag | 750-850℃ | 100 | ㆍPZT (PbO free) |
| Paron-W38 | Ag | 800-850℃ | 200 | ㆍExcellent solderability, adhesion (for ceramic substrate) |
| Paron-W51 | Ag | 800-850℃ | 200 | ㆍAg paste for AlN substrate |
| Paron-W50 | Ag | 800-850℃ | 200 | ㆍAg paste for Al203 substrate |
| Paron-W41 | Ag | 700-750℃ | 50 | ㆍFor Low CTE Glass Substrate |
| Paron-W22 | Ag | < 300℃ | 300 | ㆍLow temperature pressure type, 230W/mK |
| Paron-D10 | Cu | 860-930℃(N2) | 280-320 | ㆍThick printed copper (For attaching ceramic substrates) |
| Paron-D20 | Cu | 250-290 | ㆍThick printed copper (For building up pattern) |
|
| Paron-D30 | Cu | 110-140 | ㆍThick printed copper (For protective coating) |
| Product No. | Filler | Firing Conditions | Viscosity (Pa·s @ 10rpm) | Comments |
|---|---|---|---|---|
| Paron-L15N | Ag | 850-900℃ | 200-220 | ㆍInner paste for LTCC |
| Paron-L15G | Ag | 850-900℃ | 240-280 | ㆍGround paste for LTCC |
| Paron-L15V | Ag | 850-900℃ | 220-260 | ㆍVia paste for LTCC |
| Paron-L15T | Ag | 850-900℃ | 4-6 | ㆍThru paste for LTCC (Low viscosity) |
| Paron-MP2 series | Mo | 1,300-1,500℃ | 160-240 | ㆍPattern paste |
| Paron-MV1 | Mo | 1,300-1,500℃ | 220-260 | ㆍVia fill paste |
| Paron-H10 | W | 1,300-1,500℃ | 380-460 | ㆍPattern paste |
| Paron-H12 | W | 1,300-1,500℃ | 13-17 | ㆍVia fill paste |
仁川广域市南洞区升基川路320
320 (南村洞620-8)
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